Overview
Université McGill is procuring automated assembly systems for photonic integrated circuit (PIC) packaging. This tender is aimed at specialized manufacturers and suppliers of high-precision micro-assembly, optoelectronic packaging, and automated laboratory automation systems.
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Frequently asked questions
- When does this tender close?
- This tender closes Jul 21, 2026.
- Who is the buyer?
- Université McGill (Montréal).
- Is this tender free to view?
- Yes, viewing this tender on the Live Tender Radar is free.
- How can I respond to this tender quickly?
- tenderOS drafts a full proposal from your own past winning bids: in your voice, structure and pricing. Book a demo to see it draft a response to this RFP.